Silicon, foundries, GPUs — the substrate of everything.
105 stories · page 2 of 5
While the U.S. pours billions into physical fabrication capacity, the GAO warns that R&D funding remains stagnant, threatening the long-term viability of the domestic semiconductor ecosystem.
Nvidia’s rapid deployment of the Vera Rubin platform highlights a strategic pivot toward high-bandwidth, liquid-cooled AI infrastructure at an unprecedented scale.
While glass-core substrates are poised to revolutionize chip packaging with superior electrical and thermal properties, their commercial deployment remains elusive, challenging industry roadmaps for next-generation silicon.
Fujitsu's upcoming 144-core Monaka server CPU shifts to a disaggregated chiplet design, stacking its entire cache on a dedicated 5nm die while narrowing its vector units to 256-bit SVE2.
IBM's new mainframe chip natively executes both z/Architecture and ARM instructions within a single core, built on a 2nm process node, signaling a strategic move to broaden software support and enhance enterprise computing flexibility.
A reported 15 percent price increase on Nvidia's next-generation AI platforms highlights how high-bandwidth memory bottlenecks and packaging yields are dictating system economics.
Despite a 20% contraction in the desktop CPU market, AMD has hit record market share, signaling a fundamental divergence in how Intel and AMD are navigating the current silicon glut.
LG's new maskless Laser Direct Imaging machine aims to solve the critical throughput constraints currently plaguing high-density chip packaging and interconnect scaling.
The conviction of a former Samsung engineer reveals the technical blueprints behind CXMT's push to bypass years of DRAM process development and challenge global memory leaders.
Samsung Foundry has reportedly raised contract prices by up to 15 percent on its mature and advanced nodes, signaling tight capacity and a shifting geopolitical landscape for fabless designers.
Driven by US export controls and the diminishing returns of throttled Western GPUs, Chinese hyperscalers are pivoting to domestic silicon, forcing a rapid maturation of the country's independent semiconductor ecosystem.
With backing from AMD, Renesas, and Boeing, the Xen Project is pursuing safety-critical certifications to enable secure hardware virtualization in automotive and aerospace systems.
Google is reportedly collaborating with AMD to develop a next-generation Tensor Processing Unit that integrates custom CPU cores on-package to handle the complex, sequential logic required for reinforcement learning and agentic AI workloads.
Geopolitical volatility and resource concentration continue to threaten semiconductor production, highlighting the urgent need for supply chain diversification beyond current regional dependencies.
Intel is extending the lifecycle of its LGA 1700 platform, citing a surge in demand for Raptor Lake as high DDR5 memory costs keep cost-conscious builders tethered to DDR4.
Advanced multiphysics simulation tools are becoming indispensable for identifying and mitigating failure points in high-voltage electronics, a critical requirement for electric vehicles, data centers, and renewable energy infrastructure.
As modern AI accelerators push thermal and power limits to the brink, legacy silicon like Nvidia's 2020-era Ampere-based A100 is finding an extended lease on life through long-term cloud contracts.
Intel's successful $19.7 billion capital raise provides the critical financial runway needed to scale its 14A process node and deploy expensive High-NA EUV lithography.
As a global high-bandwidth memory shortage bites, Nvidia is reportedly testing Rubin Ultra configurations with as little as 192 GB of HBM4, forcing a strategic shift in next-generation AI cluster architecture.
Leaked Geekbench results for Nvidia's upcoming ARM-based RTX Spark SoC reveal 20-core and 18-core variants, showcasing massive multi-threaded performance that threatens both x86 mobile processors and Qualcomm's Windows on ARM dominance.
Chinese memory maker CXMT has demonstrated DDR5-8800 speeds on AMD platforms, proving that domestic silicon can match the performance of global giants despite strict export controls.
Researchers at MIT have uncovered TONTOU, a microarchitectural attack that leverages hardware timer interrupts to bypass existing Spectre mitigations on modern Intel and AMD processors.
Anthropic is establishing an in-house chip design team, signaling a strategic shift towards vertically integrated hardware-software co-design to enhance the efficiency and speed of its large language models. This move reflects a growing trend among major AI developers to control
As the semiconductor industry prepares for the post-nanosheet era, leading chipmakers are splitting over whether monolithic or sequential integration is the viable path for complementary FETs.